• 목록
• 답변
• 글쓰기
• 게시판 리스트 옵션
  • 수정
  • 삭제

Thermal management has become a crucial aspect of power electronics, as the growing demand for higher power ratings and reduced energy consumption of power electronics systems poses significant thermal management challenges. Proper thermal management is essential to maintain the reliability and longevity of power electronics components, as excessive temperatures can lead to reduced performance and even component degradation.

The main heat sources in power electronics systems are power semiconductor devices, such as power transistors, IGBTs, and MOSFETs, which dissipate heat due to thermal conductivity during operation. These devices can reach extremely high temperatures than the ambient temperature due to their small size and high power density.

Thermal management techniques can be broadly classified into two categories: thermally active and passive systems.

Passive thermal management techniques do not require the use of any external power supplies or cooling systems. These techniques are relatively low-cost and straightforward to implement. Examples of passive thermal management techniques include:

• Heat sinks with thermal interface materials (TIMs) to improve the heat movement of heat between electronic components low price
  
• Heat pipes, which use a thermal storage material to transfer heat between two points
  
• Thermal interface materials (TIMs) or thermal greases to improve convective heat transfer between components
  
  

Active thermal management techniques, on the other hand, require the use of external cooling systems or heating mechanisms to reduce temperatures in the system. Examples of active thermal management techniques include:

• Liquid cooling methods that use a coolant to transfer heat away from the power semiconductor devices
  
• Air-cooled systems that use fans to blow air over the heat sink, convecting heat away from the power semiconductor devices
  
• Two-phase cooling methods that use a two-stage cooling mechanism to transfer heat away from the power semiconductor devices
  
  

In addition to these techniques, there are also several system design considerations that influence thermal management. Including:

• Component selection and layout: selecting power semiconductor devices with high thermal resistance can lead to reduced thermal performance, while proper layout of components can improve thermal conductivity and convective heat transfer
  
• Packaging: selecting packages with built-in thermal management features, such as heat sinks or TIMs, can improve thermal performance
  
• efficient system design principles
  
  

In conclusion, thermal management is a critical aspect of power electronics that requires careful consideration of active and passive thermal management techniques, design factors, and system-level design considerations. Proper thermal management can significantly improve the reliability and longevity of power electronics systems, making them more efficient, cost-effective, and environmentally friendly.